Lenovo SR670 v2 Specifications
Form factor: 3U rack
Chipset: Intel C621A "Lewisburg" chipset, part of the platform codenamed "Whitley"
Processor: Two third-generation Intel Xeon Scalable processor (formerly codenamed "Ice Lake"). Supports processors up to 40 cores, core speeds of up to 3.6 GHz, and TDP ratings of up to 270W.
Memory: 32 DIMM slots with two processors (16 DIMM slots per processor). Each processor has 8 memory channels, with 2 DIMMs per channel (DPC). Lenovo TruDDR4 RDIMMs and 3DS RDIMMs are supported. DIMM slots are shared between standard system memory and persistent memory. DIMMs operate at up to 3200 MHz at 2 DPC.
Network Interfaces: OCP 3.0 SFF slot with flexible PCIe 4.0 x8 or x16 host interface, available depending on the server configurations: SXM model: Supported, dependent on the storage configuration, 4-DW GPU model: Supported, dependent on the configuration of PCIe slots, 8-DW GPU model: Supported.The OCP slot supports a variety of 2-port and 4-port adapters with 1GbE, 10GbE and 25GbE network connectivity. One port can optionally be shared with the XClarity Controller (XCC) management processor for Wake-on-LAN and NC-SI support.
Power supply: Up to four hot-swap redundant AC power supplies with 80 PLUS Platinum certification. 1800 W or 2400 W AC options, supporting 220 V AC. In China only, power supplies also support 240 V DC.
- SXM model: 4x 2400W
- 4-DW GPU model: 2x 2400W or 4x 1800W or 4x 2400W
- 8-DW GPU model: 4x 2400W
Dimensions: Width: 448 mm (17.6 in.), height: 131 mm (5.2 in.), depth: 892 mm (35.1 in.)
Weight: Approximate weight, dependent on the configuration selected:
- SXM model: 39.5 kg (87 lb)
- 4-DW GPU model: 36.7 kg (81 lb)
- 8-DW GPU model: 39 kg (86 lb)
Request a Quote
