Lenovo ST550 Specifications
Form Factor: 4U rackable tower
Chipset: Intel C624 "Lewisburg" chipset
Processor: Up to 2 second-generation Intel® Xeon® Platinum processor, up to 125W
Memory: Up to 768GB in 12x DIMM slots using 64GB DIMMs; 2666 and 2933MHz TruDDR4
Drive Bays: Up to 16x 2.5" (including 4 NVMe) or 8x 3.5" bays; Plus up to 4x 2.5" and 2x internal M.2 boot
Power supply: Up to two redundant hot-swap 550 W, 750 W or 1100 W High Efficiency Platinum AC power supplies, or 750 W High Efficiency Titanium AC power supplies. Also available is a 450 W fixed (non-hot-swap) power supply. In China only, all hot-swap power supplies also support 240V DC.
Expansion Slots: Up to 6x PCIe 3.0 (with 2x processors)
HBA/RAID Support: Software RAID (4x ports) standard; optional hardware RAID (up to 24x ports); up to 16-port HBAs
Network Interface: 2x 1GbE ports standard; See ST550 product guide for more options
Dimensions: Width: 176 mm (6.9 in.), height: 438 mm (17.2 in.), depth: 660 mm (26 in.).
Weight: Fully configured: 36 kg (79.36 lb)
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